p - c h a n n e l e n h a n c e m e n t m o d e m o s f e t c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . a p m 2 6 0 3 c f e a t u r e s a p p l i c a t i o n s p i n d e s c r i p t i o n o r d e r i n g a n d m a r k i n g i n f o r m a t i o n t o p v i e w o f s o t - 2 3 - 6 p - c h a n n e l m o s f e t - 2 0 v / - 4 a , r d s ( o n ) = 4 8 m w ( t y p . ) @ v g s = - 4 . 5 v r d s ( o n ) = 8 5 m w ( t y p . ) @ v g s = - 2 . 5 v r d s ( o n ) = 1 3 5 m w ( t y p . ) @ v g s = - 1 . 8 v s u p e r h i g h d e n s e c e l l d e s i g n r e l i a b l e a n d r u g g e d l e a d f r e e a n d g r e e n d e v i c e s a v a i l a b l e ( r o h s c o m p l i a n t ) p o w e r m a n a g e m e n t i n n o t e b o o k c o m p u t e r , p o r t a b l e e q u i p m e n t a n d b a t t e r y p o w e r e d s y s t e m s d d d d s g n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a - t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 c f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . g d s d d d (1,2,5,6) (4) (3) apm2603 handling code temperature range package code package code c : sot-23-6 operating junction temperature range c : -55 to 150 o c handling code tr : tape & reel assembly material g : halogen and lead free device apm2603 c : m03x x - date code assembly material
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 2 a p m 2 6 0 3 c a b s o l u t e m a x i m u m r a t i n g s ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) e l e c t r i c a l c h a r a c t e r i s t i c s ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) symbol parameter rating unit v dss drain - source voltage - 20 v gss gate - source voltage 12 v i d * continuous drain current - 4 i dm * 300 m s pulsed drain current v gs = - 4.5 v - 16 a i s * diode continuous forward current - 1.5 a t j maximum junction temperature 1 50 t stg storage temperature range - 55 to 150 c t a =25 c 1.4 p d * maximum power dissipation t a =100 c 0.5 w r q ja * thermal resistance - junction to ambient 90 c / w note : *surface mounted on 1in 2 pad area, t 5sec. apm 2603c symbol parameter test condition s min. typ. max. unit static characteristics bv dss drain - source breakdown voltage v gs =0v, i ds = - 250 m a - 20 - - v v ds = - 16 v, v gs =0v - - - 1 i dss zero gate voltage drain current t j =85 c - - - 30 m a v gs(th) gat e threshold voltage v ds =v gs , i ds = - 250 m a - 0.5 - 0. 75 - 1 v i gss gate leakage current v gs = 1 0v, v ds =0v - - 10 m a v gs = - 4.5 v, i ds = - 4 a - 48 6 0 v gs = - 2.5 v, i ds = - 2 a - 85 115 r ds(on) a drain - source on - state resistance v gs = - 1.8 v, i ds = - 0.5 a - 135 250 m w v sd a diode forward voltage i sd = - 1.5 a, v gs =0v - - 0.75 - 1.3 v gate charge characteristics b q g total gate charge - 6 8 q gs gate - source charge - 1 - q gd gate - drain charge v ds = - 10 v, v gs = - 4.5 v, i d s = - 4 a - 2.3 - nc
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 3 a p m 2 6 0 3 c e l e c t r i c a l c h a r a c t e r i s t i c s ( c o n t . ) ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) apm 2603c symbol parameter test condition s min. typ. max. unit dynamic characteristics b r g gate resistance v gs = 0 v,v ds =0v ,f=1mhz - 10 - w c iss input capacitance - 600 - c oss output capacitance - 125 - c rss r everse transfer capacitance v gs =0v, v ds = - 10v, f requency =1.0mhz - 95 - pf t d(on) turn - on delay time - 8 15 t r turn - on rise time - 14 26 t d(off) turn - off delay time - 28 51 t f turn - off fall time v dd = - 10 v, r l = 10 w , i d s = - 1a, v gen = - 4.5v , r g =6 w - 42 77 ns t rr reverse recovery time - 13 - ns q rr reverse recovery charge i d s = - 4 a, dl sd /dt = 100a/ m s - 5 - nc note a : pulse test ; pulse width 3 00 m s, duty cycle 2% . note b : guaranteed by design, not subject to production testing .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 4 a p m 2 6 0 3 c t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s -i d - drain current (a) d r a i n c u r r e n t t j - j u n c t i o n t e m p e r a t u r e ( c ) s a f e o p e r a t i o n a r e a - v d s - d r a i n - s o u r c e v o l t a g e ( v ) normalized transient thermal resistance t h e r m a l t r a n s i e n t i m p e d a n c e s q u a r e w a v e p u l s e d u r a t i o n ( s e c ) p o w e r d i s s i p a t i o n p tot - power (w) t j - j u n c t i o n t e m p e r a t u r e ( c ) -i d - drain current (a) 0 20 40 60 80 100 120 140 160 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 t a =25 o c 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 t a =25 o c,v g =-4.5v 0.01 0.1 1 10 100 0.01 0.1 1 10 50 300 m s rds(on) limit 1s t a =25 o c 10ms 1ms 100ms dc 1e-4 1e-3 0.01 0.1 1 10 100 1e-3 0.01 0.1 1 2 mounted on 1in 2 pad r q ja : 90 o c/w 0.01 0.02 0.05 0.1 0.2 single pulse duty = 0.5
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 5 a p m 2 6 0 3 c r ds(on) - on - resistance (m w ) d r a i n - s o u r c e o n r e s i s t a n c e - i d - d r a i n c u r r e n t ( a ) t j - j u n c t i o n t e m p e r a t u r e ( c ) g a t e t h r e s h o l d v o l t a g e - v d s - d r a i n - s o u r c e v o l t a g e ( v ) -i d - drain current (a) o u t p u t c h a r a c t e r i s t i c s d r a i n - s o u r c e o n r e s i s t a n c e - v g s - g a t e - s o u r c e v o l t a g e ( v ) r ds(on) - on - resistance (m w ) normalized threshold voltage 1 2 3 4 5 6 7 8 9 10 20 30 40 50 60 70 80 90 100 i d =-4a -50 -25 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 i ds = -250 m a 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 2 4 6 8 10 12 14 16 -2.5v -1.5v -2v v gs = -3-3.5,-4,-5,-6,-7,-8,-9,-10v 0 2 4 6 8 10 12 14 16 0 20 40 60 80 100 120 140 160 180 200 v gs =-1.8v v gs =-4.5v v gs =-2.5v t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 6 a p m 2 6 0 3 c - v d s - d r a i n - s o u r c e v o l t a g e ( v ) d r a i n - s o u r c e o n r e s i s t a n c e normalized on resistance t j - j u n c t i o n t e m p e r a t u r e ( c ) c - capacitance (pf) - v s d - s o u r c e - d r a i n v o l t a g e ( v ) s o u r c e - d r a i n d i o d e f o r w a r d -i s - source current (a) c a p a c i t a n c e g a t e c h a r g e q g - g a t e c h a r g e ( n c ) -v gs - gate - source voltage (v) -50 -25 0 25 50 75 100 125 150 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 r on @t j =25 o c: 48m w v gs = -10v i ds = -4a 0.0 0.3 0.6 0.9 1.2 1.5 1.8 0.1 1 10 20 t j =150 o c t j =25 o c 0 4 8 12 16 20 0 100 200 300 400 500 600 700 800 900 frequency=1mhz crss coss ciss t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) 0 2 4 6 8 10 12 0 1 2 3 4 5 6 7 8 9 10 v ds = -10v i d = -4a
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 7 a p m 2 6 0 3 c p a c k a g e i n f o r m a t i o n s o t - 2 3 - 6 0 l view a 0 . 2 5 gauge plane seating plane a a 2 a 1 e d e 1 see view a b c e1 e 0 8 0 8 0.020 0.009 0.006 0.024 0.051 0.057 max. 0.30 l 0 e e e1 e1 d c b 0.08 0.30 0.012 0.60 0.95 bsc 1.90 bsc 0.50 0.22 0.075 bsc 0.037 bsc 0.012 0.003 millimeters min. s y m b o l a1 a2 a 0.00 0.90 sot-23-6 max. 1.30 0.15 1.45 min. 0.000 0.035 inches 1.40 2.60 3.00 1.80 2.70 3.10 0.118 0.071 0.122 0.102 0.055 0.106 note : 1. follow jedec to-178 ab. 2. dimension d and e1 do not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 8 a p m 2 6 0 3 c application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.30 1.75 ? 0.10 3.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sot - 23 - 6 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.0 min. 0.6+0.00 - 0.40 3.20 ? 0.20 3.10 ? 0.20 1.50 ? 0.20 (mm) c a r r i e r t a p e & r e e l d i m e n s i o n s h t1 a d a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 d e v i c e s p e r u n i t package type unit quantity sot - 23 - 6 tape & reel 3000
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 9 a p m 2 6 0 3 c t a p i n g d i r e c t i o n i n f o r m a t i o n s o t - 2 3 - 6 r e f l o w c o n d i t i o n ( i r / c o n v e c t i o n o r v p r r e f l o w ) t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 t e m p e r a t u r e time critical zone t l to t p r e l i a b i l i t y t e s t p r o g r a m test item method description solderability mil - std - 883d - 2003 245 c, 5 sec holt mil - std - 883d - 1005.7 1000 hrs bias @125 c pct jesd - 22 - b, a102 168 hrs, 100 % rh, 121 c tst mil - std - 883d - 1011.9 - 65 c~150 c, 200 cycles aaax aaax aaax aaax aaax aaax aaax user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 0 8 w w w . a n p e c . c o m . t w 1 0 a p m 2 6 0 3 c profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat - temperature min (tsmin) - temperature max (tsmax) - time (min to max) (ts) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (t l ) - time (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak /classification temperature (tp) see table 1 see table 2 time within 5 c of actual peak temperature (tp) 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/sec ond max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package. measured on the body surface. c l a s s i f i c a t i o n r e f l o w p r o f i l e s table 2. pb - free process ? package classification reflow temperatures package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 +0 c* 260 +0 c* 260 +0 c* 1.6 mm ? 2.5 mm 260 +0 c* 250 +0 c* 245 +0 c* 3 2.5 mm 250 +0 c* 245 +0 c* 245 +0 c* *tolerance: the device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means peak reflow temperature +0 c. for example 260 c+0 c) at the rated msl level. table 1. snpb eutectic process ? package peak reflow temperature s package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 240 +0/ - 5 c 225 +0/ - 5 c 3 2.5 mm 225 +0/ - 5 c 225 +0/ - 5 c c u s t o m e r s e r v i c e anpec electronics corp. head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 taipei branch : 2f, no. 11, lane 218, sec 2 jhongsing rd., sindain city, taipei county 23146, taiwan tel : 886-2-2910-3838 fax : 886-2-2917-3838
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